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SL3ICS1002F7AF 数据表(PDF) 3 Page - NXP Semiconductors

部件名 SL3ICS1002F7AF
功能描述  UCODE G2XM and G2XL
PDF  51 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  NXP [NXP Semiconductors]
网页  http://www.nxp.com
标志 NXP - NXP Semiconductors

SL3ICS1002F7AF 数据表(HTML) 3 Page - NXP Semiconductors

  SL3ICS1002F7AF Datasheet HTML 1Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 2Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 3Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 4Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 5Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 6Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 7Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 8Page - NXP Semiconductors SL3ICS1002F7AF Datasheet HTML 9Page - NXP Semiconductors Next Button
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139037
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 3.7 — 9 October 2012
139037
3 of 51
NXP Semiconductors
SL3ICS1002/1202
UCODE G2XM and G2XL
3.
Applications
Supply chain management
Item level tagging
Asset management
Container identification
Pallet and case tracking
Product authentication
Outside above mentioned applications, please contact NXP Semiconductors for support.
4.
Ordering information
Table 1.
Ordering information G2XM
Type number
Package
Name
Description
Version
SL3ICS1002FUG/V7AF
Wafer
Bumped die on sawn wafer
-
SL3S1002FTT
TSSOP8
plastic thin shrink small outline package;
8 leads; body width 3 mm
SOT505-1
SL3S1002FTB1
XSON3
plastic extremely thin small outline
package;3 terminals;
body 1 x 1.45 x 0,5 mm
SOT1122
Table 2.
Ordering information G2XL
Type number
Package
Name
Description
Version
SL3ICS1202FUG/V7AF
Wafer
Bumped die on sawn wafer
-
SL3S1202FTT
TSSOP8
plastic thin shrink small outline package;
8 leads; body width 3 mm
SOT505-1
SL3S1202FTB1
XSON3
plastic extremely thin small outline
package;3 terminals;
body 1 x 1.45 x 0,5 mm
SOT1122



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