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SL3ICS1002F7AF 数据表(PDF) 3 Page - NXP Semiconductors |
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SL3ICS1002F7AF 数据表(HTML) 3 Page - NXP Semiconductors |
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3 / 51 page ![]() 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 9 October 2012 139037 3 of 51 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 3. Applications Supply chain management Item level tagging Asset management Container identification Pallet and case tracking Product authentication Outside above mentioned applications, please contact NXP Semiconductors for support. 4. Ordering information Table 1. Ordering information G2XM Type number Package Name Description Version SL3ICS1002FUG/V7AF Wafer Bumped die on sawn wafer - SL3S1002FTT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 SL3S1002FTB1 XSON3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5 mm SOT1122 Table 2. Ordering information G2XL Type number Package Name Description Version SL3ICS1202FUG/V7AF Wafer Bumped die on sawn wafer - SL3S1202FTT TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 SL3S1202FTB1 XSON3 plastic extremely thin small outline package;3 terminals; body 1 x 1.45 x 0,5 mm SOT1122 |
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