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SL3ICS1002F7AF 数据表(PDF) 44 Page - NXP Semiconductors |
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SL3ICS1002F7AF 数据表(HTML) 44 Page - NXP Semiconductors |
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44 / 51 page  139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 9 October 2012 139037 44 of 51 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 18. Revision history Table 32. Revision history Document ID Release date Data sheet status Change notice Supersedes SL3ICS1002_1202 v.3.7 20121009 Product data sheet - 139036 Modifications: • Update of the delivery form 139036 20110310 Product data sheet 139035 Modifications: • Table 4 “TSSOP8 Marking”: added • Section 14.1.1.2 “Special behavior of user memory address 1Fh”: added 139035 20091102 Product data sheet 139034 Modifications: • Type SOT1122 added • Figure 2 “Wafer layout and pinning information”: correction of drawing 139034 20090721 Product data sheet 139033 Modifications: • Table 11 “TSSOP8 characteristics” andTable 9 “Package interface characteristics” :removed “Memory characteristics” 139033 20090605 Product data sheet - 139032 139132 Modifications: • This data sheet is a combination of data sheets SL3ICS1002 and SL3ICS1202 • New type FCS2 Aluminum, SOT1040AB2 added • Section 8.1.6 “Fail die identification”: added • Section 11 “Packing information”: edited 139032 20080716 Product data sheet 139031 Modifications: • rephrasing of Section 2 “Features and benefits” on page 2 • added “calibrate command” in Section 2 “Features and benefits” on page 2 • redesign of Figure 1 “Block diagram of G2X IC” on page 4 • merging of Fig. 2 Pinning and Fig. 3 Wafer layout - see Figure 2 “Wafer layout and pinning information” on page 5 • added type “FCS2 Polymer Strap - SOT1040AA1” in Section 4 “Ordering information”, Section 6 “Wafer layout and pinning information”, Section 7 “Package outline”, Section 8 “Mechanical specification”, Section 9 “Limiting values”, Section 10 “Characteristics” • added Section 11 “Handling information for Flip Chip Strap (FCS2, SOT1040)” on page 19 • added Section 11 “Packing information” on page 14 • added Table 10 “Symbol description” on page 16 • correction of Table 13 “Memory map” on page 24 • removed “ongoing” in 32 bit ongoing in Section 2.1 and Table 12 “G2X memory sections” 139031 20080428 Product data sheet 139030 |
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