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SL3ICS1002F7AF 数据表(PDF) 6 Page - NXP Semiconductors |
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SL3ICS1002F7AF 数据表(HTML) 6 Page - NXP Semiconductors |
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6 / 51 page ![]() 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 9 October 2012 139037 6 of 51 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL 7. Package outline Fig 3. Package TSSOP8, SOT505-1 Table 3. Pin description of TSSOP8 Symbol Pin Description RFN 1 Grounded antenna connector - 2 to 7 Not used RFP 8 Ungrouded antenna connector UNIT A1 A max. A2 A3 bp L HE Lp wy v ce D(1) E(2) Z(1) q REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.45 0.25 0.28 0.15 3.1 2.9 3.1 2.9 0.65 5.1 4.7 0.70 0.35 6 ° 0° 0.1 0.1 0.1 0.94 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 0.7 0.4 SOT505-1 99-04-09 03-02-18 w M bp D Z e 0.25 14 8 5 q A A2 A1 Lp (A3) detail X L HE E c v M A X A y 2.5 5 mm 0 scale TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505-1 1.1 pin 1 index |
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