STA335W datasheet(39/43 Pages) STMICROELECTRONICS

39 / 43 page

STA335W

Package thermal characteristics

39/43

Package thermal characteristics

Using a double-layer PCB the thermal resistance junction to ambient with 2 copper ground

areas of 3 x 3 cm2 and with 16 via holes (see Figure 11) is 24 °C/W in natural air convection.

The dissipated power within the device depends primarily on the supply voltage, load

impedance and output modulation level.

Thus, the maximum estimated dissipated power for the STA335W is:

Figure 11.

Double-layer PCB with 2 copper ground areas and 16 via holes

Figure 12 shows the power derating curve for the PowerSSO-36 package on PCBs with

copper areas of 2 x 2 cm2 and 3 x 3 cm2.

Figure 12.

PowerSSO-36 power derating curve

2 x 20 W @ 8

Ω, 18 V

Pd max ~ 4 W

2 x 10 W + 1 x 20 W @ 4

Ω, 8 Ω, 18 V

Pd max < 5 W

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

STA335W

PSSO36

Copper Area 3x3 cm

and via holes

100

120

140

160

100

120

140

160

Pd (W)

Tamb ( °C)

Copper Area 2x2 cm

and via holes

Copper Area 2x2 cm

and via holes

STA335W

PSSO36

STA335W

PSSO36

Copper Area 3x3 cm

and via holes

Copper Area 3x3 cm

and via holes

STA335W 数据表(PDF) 39 Page - STMicroelectronics

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