ADRF6702ACPZ-R7 datasheet(35/36 Pages) AD

35 / 36 page

Data Sheet

ADRF6702

Rev. B | Page 35 of 36

OUTLINE DIMENSIONS

4.25

4.10 SQ

3.95

TOP

VIEW

6.00

BSC SQ

PIN 1

INDICATOR

5.75

BSC SQ

12° MAX

0.30

0.23

0.18

0.20 REF

SEATING

PLANE

1.00

0.85

0.80

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.80 MAX

0.65 TYP

4.50

REF

0.50

0.40

0.30

0.50

BSC

PIN 1

INDICATOR

0.60 MAX

0.25 MIN

EXPOSED

PAD

(BOT TOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 57. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

6 mm × 6 mm Body, Very Thin Quad

(CP-40-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range (°C)

Package Description

Package Option

ADRF6702ACPZ-R7

−40°C to +85°C

40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-40-1

ADRF6702-EVALZ

Evaluation Board

1 Z = RoHS Compliant Part.

ADRF6702ACPZ-R7 数据表(PDF) 35 Page - Analog Devices

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