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COMBOSOLAR 数据表(PDF) 48 Page - Texas Instruments |
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COMBOSOLAR 数据表(HTML) 48 Page - Texas Instruments |
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48 / 57 page ![]() 35 33 31 29 27 25 23 21 19 17 15 0.5 1 1.5 2 2.5 Cu Thickness (oz) Four-Layer PCB, PCB Area = 4.32 in , 2 oz Cu (Results are from thermal simulations) 2 28 26 24 22 20 18 16 14 12 10 2 4 6 8 10 12 14 PCB Area (in ) 2 THERMAL RESISTANCE vs BOARD AREA Four-Layer PCB, 2 oz Cu (Results are from thermal simulations) 1 2 3 4 5 6 7 8 Number of Layers 36 34 32 30 28 26 24 22 20 THERMAL RESISTANCE vs NUMBER OF PCB LAYERS PCB Area = 3 in , 2 oz Cu (Results are from thermal simulations) 2 AFE031 SBOS531D – AUGUST 2010 – REVISED MAY 2012 www.ti.com Increasing the number of layers in the PCB, using thicker copper, and increasing the PCB area are all factors that improve the spread of heat. Figure 55 through Figure 57, respectively, show thermal resistance performance as a function of each of these factors. Figure 55. Thermal Resistance as a Function of the Number of Layers in the PCB Figure 56. Thermal Resistance as a Function of PCB Area Figure 57. Thermal Resistance as a Function of Copper Thickness 48 Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): AFE031 |
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