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COMBOSOLAR 数据表(PDF) 49 Page - Texas Instruments

部件名 COMBOSOLAR
功能描述  Powerline Communications Analog Front-End
PDF  57 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

COMBOSOLAR 数据表(HTML) 49 Page - Texas Instruments

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AFE031
www.ti.com
SBOS531D – AUGUST 2010 – REVISED MAY 2012
For additional information on thermal PCB design using exposed thermal pad packages, refer to Application
Report SBOA130, Analog Front-End Design for a Narrowband Power-Line Communications Modem Using the
AFE031 and Application Report SLMA002E, PowerPAD™ Thermally-Enhanced Package (both available for
download at www.ti.com).
Powerline Communications Developer’s Kit
A PLC developer’s kit (TMDSPLCKIT-V3) is available to order at www.ti.com/plc. This kit offers complete
hardware and software solutions for introducing flexible, efficient, and reliable networking capabilities to a wide
variety of applications. With unique modular hardware architecture and flexible software framework, TI’s PLC
solutions are the only PLC-based technology capable of supporting multiple protocol standards and modulation
schemes with a single platform. This technology enables designers to leverage product lines across global
markets. The flexibility of the platform also allows developers to optimize hardware and software performance for
specific environmental operating conditions while simplifying end-to-end product design. Based on TI’s powerful
C2000™ microcontroller architecture and the AFE031, developers can select the correct blend of processing
capacity and peripherals to either add powerline communications to an existing design or implement a complete
application with PLC communications.
The C2000 Powerline Modem Developer's Kit enables easy development of software-based PLC modems. The
kit includes two PLC modems based on the C2000 TMS320F28069 controlCARD and the AFE031. The included
PLC SUITE software supports several communication techniques, including OFDM (PRIME/G3 and FlexOFDM)
and SFSK. The kit also includes onboard USB JTAG emulation and Code Composer Studio.
PACKAGING/MECHANICALS
Complete mechanical drawings and packaging information are appended to the end of this data sheet.
Copyright © 2010–2012, Texas Instruments Incorporated
49
Product Folder Link(s): AFE031



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