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COMBOSOLAR 数据表(PDF) 10 Page - Texas Instruments

部件名 COMBOSOLAR
功能描述  Powerline Communications Analog Front-End
PDF  57 Pages
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制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

COMBOSOLAR 数据表(HTML) 10 Page - Texas Instruments

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AFE031
SBOS531D – AUGUST 2010 – REVISED MAY 2012
www.ti.com
ELECTRICAL CHARACTERISTICS: Power Supply
At TJ = +25°C, PA_VS = 16 V, VAVDD = VDVDD = 3.3 V, and 10 kΩ connected to PA_ISET (pin 46), unless otherwise noted.
AFE031
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
Operating Supply Range
Power amplifier supply voltage
PA_VS
+7
+24
V
Digital supply voltage
DVDD
+3.0
+3.6
V
Analog supply voltage
AVDD
+3.0
+3.6
V
Quiescent Current
SD pin low
IO = 0, PA = On
(1)
49
61
mA
Power amplifier current
IQPA_VS
IO = 0, PA = Off
(2)
10
μA
Tx configuration(3)
1.2
mA
Digital supply current
IQDVDD
Rx configuration(4)
5
μA
All blocks disabled(5)
5
μA
Tx configuration(3)
2.8
3.7
mA
Analog supply current
IQAVDD
Rx configuration(4)
3.6
5.3
mA
All blocks disabled(5)
30
μA
Shutdown (SD)
Power amplifier supply voltage
PA_VS
SD pin high
75
150
μA
Digital supply voltage
DVDD
SD pin high
5
10
μA
Analog supply voltage
AVDD
SD pin high
15
40
μA
Temperature
Specified range
–40
+125
°C
(1)
Enable1 Register = 00100011, Enable2 Register = 00001110.
(2)
Enable1 Register = 00000100, Enable2 Register = 00000110.
(3)
In the Tx configuration, the following blocks are enabled: DAC, Tx, PA, REF1, and REF2. All other blocks are disabled. Enable1
Register = 00100011, Enable2 Register = 00001110.
(4)
In the Rx configuration, the following blocks are enabled: Rx, REF1, and REF2. All other blocks are disabled. Enable1 Register =
00000100, Enable2 Register = 00000110.
(5)
Enable1 Register = 00000000, Enable2 Register = 00000000.
THERMAL INFORMATION
AFE031
THERMAL METRIC(1)
RGZ (QFN)
UNITS
48 PINS
θJA
Junction-to-ambient thermal resistance
27.8
θJCtop
Junction-to-case (top) thermal resistance
12.1
θJB
Junction-to-board thermal resistance
7.5
°C/W
ψJT
Junction-to-top characterization parameter
0.4
ψJB
Junction-to-board characterization parameter
7.4
θJCbot
Junction-to-case (bottom) thermal resistance
1.7
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
10
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): AFE031



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