MPC8347ECVRADDB datasheet(54/99 Pages) FREESCALE

54 / 99 page

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12

Freescale Semiconductor

Package and Pin Listings

Figure 38 and Figure 39 represent the AC timings from Table 54. Note that although the specifications

generally reference the rising edge of the clock, these AC timing diagrams also apply when the falling edge

is the active edge.

Figure 38 shows the SPI timings in slave mode (external clock).

Figure 38. SPI AC Timing in Slave Mode (External Clock) Diagram

Figure 39 shows the SPI timings in master mode (internal clock).

Figure 39. SPI AC Timing in Master Mode (Internal Clock) Diagram

18 Package and Pin Listings

This section details package parameters, pin assignments, and dimensions. The MPC8347EA is available

in two packages—a tape ball grid array (TBGA) and a plastic ball grid array (PBGA). See Section 18.1,

“Package Parameters for the MPC8347EA TBGA,” Section 18.2, “Mechanical Dimensions for the

MPC8347EA TBGA,” Section 18.3, “Package Parameters for the MPC8347EA PBGA,” and

Section 18.4, “Mechanical Dimensions for the MPC8347EA PBGA.”

18.1

Package Parameters for the MPC8347EA TBGA

The package parameters are provided in the following list. The package type is 35 mm

× 35 mm, 672 tape

ball grid array (TBGA).

Package outline

35 mm

× 35 mm

Interconnects

672

SPICLK (Input)

tNEIXKH

tNEIVKH

tNEKHOX

Input Signals:

SPIMOSI

(See Note)

Output Signals:

SPIMISO

(See Note)

Note: The clock edge is selectable on SPI.

SPICLK (Output)

tNIIXKH

tNIKHOX

Input Signals:

SPIMISO

(See Note)

Output Signals:

SPIMOSI

(See Note)

Note: The clock edge is selectable on SPI.

tNIIVKH

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