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AS1374 数据表(PDF) 12 Page - ams AG |
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AS1374 数据表(HTML) 12 Page - ams AG |
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12 / 19 page ![]() AS1374 Datasheet - Application In form atio n www.austriamicrosystems.com/LDOs/AS1374 Revision 1.8 11 - 18 9.3 Power Dissipation Maximum power dissipation (PD) of the LDO is the sum of the power dissipated by the internal series MOSFET and the quiescent current required to bias the internal voltage reference and the internal error amplifier, and is calculated as: Watts (EQ 3) Internal power dissipation as a result of the bias current for the internal voltage reference and the error amplifier is calculated as: Watts (EQ 4) Total LDO power dissipation is calculated as: Watts (EQ 5) 9.4 Junction Temperature Under all operating conditions, the maximum junction temperature should not be allowed to exceed 125°C (unless otherwise specified in the datasheet). Limiting the maximum junction temperature requires knowledge of the heat path from junction to case ( JC°C/W fixed by the IC manufacturer), and adjustment of the case to ambient heat path ( CA°C/W) by manipulation of the PCB copper area adjacent to the IC position. Figure 27. Package Physical Arrangements PD MAX Seriespass I LOAD MAX = V IN MAX V OUT MIN – PD MAX Bias V IN MAX IQ = PD MAX Total PD MAX Seriespass PD MAX + Bias = Chip PCB Package Transfer Layer CS-WLP Package Solder Balls |
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