AS1374

Datasheet - Absolute Maximum Rat i ngs

www.austriamicrosystems.com/LDOs/AS1374

Revision 1.8

3 - 18

5 Absolute Maximum Ratings

Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of

the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 4 is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

Table 2. Absolute Maximum Ratings

Parameter

Min

Max

Units

Comments

Electrical Parameters

VDD to GND

-0.3

7

V

All other pins to GND

-0.3

V

Output Short-Circuit Duration

Infinite

Input Current (latch-up immunity)

-100

100

mA

Norm: JEDEC 78

Electrostatic Discharge

Electrostatic Discharge HBM

2

kV

Norm: MIL 883 E method 3015

Temperature Ranges and Storage Conditions

Thermal Resistance

201.7

ºC/W

Junction-to-ambient thermal resistance is very

dependent on application and board-layout. In

situations where high maximum power dissipation

exists, special attention must be paid to thermal

dissipation during board design.

Junction Temperature

+125

ºC

Storage Temperature Range

-55

+150

ºC

Package Body Temperature

+260

ºC

The reflow peak soldering temperature (body

temperature) specified is in accordance with IPC/

JEDEC J-STD-020“Moisture/Reflow Sensitivity

Classification for Non-Hermetic Solid State Surface

Mount Devices”.

Humidity non-condensing

5

85

%