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M2S005 数据表(PDF) 17 Page - Microsemi Corporation |
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M2S005 数据表(HTML) 17 Page - Microsemi Corporation |
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17 / 27 page  18 www.microsemi.com/fpga-soc FPGA Packages CS121 f IGLOO ProASIC3 p s 6x6 mm h 0.90 mm p 0.50 mm CS81 f IGLOO IGLOO nano p s 5x5 mm h 0.80 mm p 0.50 mm UC81 f IGLOO IGLOO nano p s 4x4 mm h 0.80 mm p 0.40 mm UC36 f IGLOO nano p s 3x3 mm h 0.80 mm p 0.40 mm FG896 f SmartFusion2 IGLOO2 IGLOOe1 ProASIC3E1 ProASIC3L1 Military ProASIC3/EL1 p s 31x31 mm h 2.23 mm p 1.00 mm FG144 f IGLOO1 ProASIC31 ProASIC3L1 Military ProASIC3/EL1 p s 13x13 mm h 1.45 mm p 1.00 mm FC1152 f IGLOO2 p s 35x35 mm h 2.62 mm p 1.00 mm FG256 f SmartFusion Fusion1, 3, 4 IGLOO1 IGLOOe ProASIC31, 2 ProASIC3E2 ProASIC3L1 p s 17x17 mm h 1.60 mm p 1.00 mm FG676 f IGLOO2 ProASIC3E1 Fusion1 p s 27x27 mm h 2.23 mm p 1.00 mm FG484 f SmartFusion2 SmartFusion Fusion1, 3 IGLOO2 IGLOO1 IGLOOe1 ProASIC31, 2 ProASIC3E1, 2 ProASIC3L1 Military ProASIC3/EL1 p s 23x23 mm h 2.23 mm p 1.00 mm FG324 f ProASIC3E1 ProASIC3L1 p s 19x19 mm h 1.63 mm p 1.00 mm VF400 f SmartFusion2 IGLOO2 p s 17x17 mm h 1.41 mm p 0.80 mm CS196 f IGLOO p s 8x8 mm h 1.11 mm p 0.50 mm CS201 f IGLOO PLUS p s 8x8 mm h 0.89 mm p 0.50 mm CS281 f IGLOO1 IGLOO PLUS p s 10x10 mm h 1.05 mm p 0.50 mm CS288 f SmartFusion p s 11x11 mm h 1.05 mm p 0.50 mm CS289 f IGLOO PLUS p s 14x14 mm h 1.20 mm p 0.80 mm QN68 f IGLOO IGLOO nano ProASIC3 ProASIC3 nano p s 8x8 mm h 0.90 mm p 0.40 mm QN48 f IGLOO IGLOO nano ProASIC3 ProASIC3 nano p s 6x6 mm h 0.90 mm p 0.40 mm QN108 f Fusion p s 8x8 mm h 0.75 mm p 0.50 mm QN132 f IGLOO ProASIC3 p s 8x8 mm h 0.75 mm p 0.50 mm QN180 f Fusion p s 10x10 mm h 0.75 mm p 0.50 mm Key: f – family bs – package body size excluding leads ps – overall package dimensions including package leads h – package thickness p – pin pitch / ball pitch Notes: 1 Includes Cortex-M1 devices. 2 FG256 and FG484 are footprint-compatible for ProASIC3 and ProASIC3E. 3 Pigeon Point devices are only offered in FG484 and FG256. 4 MicroBlade devices are only offered in FG256. |
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