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STPS40M60CT 数据表(PDF) 5 Page - STMicroelectronics |
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STPS40M60CT 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 10 page ![]() STPS40M60C Characteristics Doc ID 018813 Rev 1 5/10 Figure 10. Forward voltage drop versus forward current (per diode, low level) Figure 11. Forward voltage drop versus forward current (per diode, high level) I (A) FM 0 5 10 15 20 25 30 35 40 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 Tj=25°C (Maximum values) Tj=125°C (Maximum values) Tj=125°C (Typical values) V (V) FM I (A) FM 0.1 1.0 10.0 100.0 1000.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Tj=25°C (Maximum values) Tj=125°C (Maximum values) Tj=125°C (Typical values) V (V) FM Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D2PAK Figure 13. Reverse safe operating area (tp < 1 µs and Tj < 150 °C) R (°C/W) th(j-a) 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 DPAK 2 Epoxy printed board FR4 copper thickness = 35 µm S (cm ) Cu 2 I (A) arm 50.0 55.0 60.0 65.0 70.0 75.0 80.0 85.0 90.0 80 85 90 95 100 105 110 115 120 125 130 V (V) arm Forbidden area Permitted area |
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