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80960KB 数据表(PDF) 30 Page - Intel Corporation

部件名 80960KB
功能描述  EMBEDDED 32-BIT MICROPROCESSOR WITH INTEGRATED FLOATING-POINT UNIT
PDF  39 Pages
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制造商  INTEL [Intel Corporation]
网页  http://www.intel.com
标志 INTEL - Intel Corporation

80960KB 数据表(HTML) 30 Page - Intel Corporation

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80960KB
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3.3.
Package Thermal Specification
The 80960KB is specified for operation when case
temperature is within the range 0°C to 85°C (PGA) or
0°C to 100°C (PQFP). Measure case temperature at
the top center of the package. Ambient temperature
can be calculated from:
TJ = TC + P*θjc
TA = TJ + P*θja
TC = TA + P*[θja−θjc]
Values for
θ
ja and θjc for various airflows are given in
Table 12 for the PGA package and in Table 12 for the
PQFP package. The PGA’s
θ
ja can be reduced by
adding a heatsink. For the PQFP, however, a heatsink
is not generally used since the device is intended to
be surface mounted.
Maximum
allowable
ambient
temperature
(TA)
permitted without exceeding TC is shown by the
graphs in Figures 23, 24, 25 and 26. The curves
assume the maximum permitted supply current (ICC)
at each speed, VCC of +5.0 V and a TCASE of +85°C
(PGA) or +100°C (PQFP).
If the 80960KB is to be used in a harsh environment
where the ambient temperature may exceed the limits
for the normal commercial part, consider using an
extended temperature device. These components are
designated by the prefix “TA” and are available at 16,
20 and 25 MHz in the ceramic PGA package.
Extended operating temperature range is –40° C to
+125°C (case).
Figure 26 shows the maximum allowable ambient
temperature for the 20 MHz extended temperature
TA80960KB at various airflows. The curve assumes
an ICC of 420 mA, VCC of 5.0 V and a TCASE of
+125°C.
Table 14. 80960KB PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
50
(0.25)
100
(0.50)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
θ Junction-to-Case
2
2
2
2
2
2
2
θ Case-to-Ambient
(No Heatsink)
19
18
17
15
12
10
9
θ Case-to-Ambient
(Omnidirectional
Heatsink)
16
15
14
12
9
7
6
θ Case-to-Ambient
(Unidirectional
Heatsink)
15
14
13
11
8
6
5
NOTES:
1.
This table applies to 80960KB PGA plugged into
socket or soldered directly to board.
2.
θ
JA = θJC + θCA
3.
θ
J-CAP = 4°C/W (approx.)
θ
J-PIN = 4°C/W (inner pins) (approx.)
θ
J-PIN = 8°C/W (outer pins) (approx.)
θ
JC
θ
JA
θ
J-PIN
θ
J-CAP



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