TN0108

Pin configuration

Doc ID 15874 Rev 2

9/26

Note that not all of these pads are available in all packages! Consult the device reference

manual for details. This gives a total of 40 medium speed pads in the 144 QPF package and

25 medium speed pads in the 100 QFP package.

Customers must be careful of the number of pads that are switched together with the

resulting increase in current. The sum of the current on each pad segment must not exceed

the maximum current, as defined in the device datasheet.

3.3

Input/output state during and after reset

On Cut 1 devices, the input/output pins are set to high impedance (tri stated) during reset.

Once reset has been released, the input/output pins are set to input with weak pull-ups

enabled.

On Cut 2 devices, the input/output are set to high impedance during reset and remain in this

state, once the reset has been released.

The following pins are critical to boot operation and are not in high impedance state during

reset:

●

PA[9] (FAB) is pull-down. Without external strong pull-up the device starts fetching from

Flash

●

PA[8] (ABS) is pull-up

●

RESET pad is driven low. This is pull-up only after PHASE2 reset completion

●

JTAG pads (TCK, TMS, and TDI) are pull-up, whilst TDO remains tri state

●

Nexus output pads (MDO[n], MCKO, EVTO, MSEO) are forced to output

3.4

GPIO pin configuration in standby mode

On Cut 2 devices, if GPIO pull-ups are active on standby entry, the pull-up will remain active

on standby exit, until such a point as the pull-up is cleared by software.

Table 6.

I/O state during and after reset

Silicon revision

Input/output pins during

reset

Input/output pins after reset

SPC560B Cut 1.1

High impedance

Input, weak pull-up

SPC560B Cut 2

High impedance

High Impedance except JTAG and ABS that

are input, weak pull-up