4

µPD6708

7.2

Slave Transmission ......................................................................................................................................... 44

7.2.1

Data transmission ............................................................................................................................ 44

7.2.2

Transmitting slave status address and lock address ................................................................. 45

7.3

Master Reception ............................................................................................................................................. 45

7.4

Slave Reception ............................................................................................................................................... 46

7.5

Broadcast Reception ....................................................................................................................................... 47

8.

EXAMPLE OF HOST CONTROLLER PROCESSING FLOW ................................................................ 48

8.1

Main Routine ..................................................................................................................................................... 48

8.2

Interrupt Service Routine ................................................................................................................................49

8.3

Processing Routine ......................................................................................................................................... 50

8.3.1

µPD6708 initialization routine......................................................................................................... 50

8.3.2

Communication control command processing routine .............................................................. 51

8.3.3

Master transmission processing routine ...................................................................................... 57

8.3.4

Slave data transmission processing routine ............................................................................... 58

8.3.5

Master reception processing routine ............................................................................................ 59

9.

ELECTRICAL SPECIFICATIONS ............................................................................................................ 63

10. PACKAGE DRAWINGS ............................................................................................................................ 67

11. RECOMMENDED SOLDERING CONDITIONS ....................................................................................... 69

APPENDIX

MAJOR DIFFERENCES BETWEEN

µPD6708 AND µPD72042A, µPD72042B ................... 70