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LTC1402IGN 数据表(PDF) 14 Page - Linear Technology |
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LTC1402IGN 数据表(HTML) 14 Page - Linear Technology |
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14 / 20 page ![]() 14 LTC1402 Low impedance analog and digital power supply common returns are essential to low noise operation of the ADC and the foil width for these tracks should be as wide as possible. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC1402 has differential inputs to minimize noise coupling. Common mode noise on the AIN+ and AIN– leads will be rejected by the input CMRR. The AIN– input can be used as a ground sense for the AIN+ input; the LTC1402 will hold and convert the difference voltage between AIN+ and AIN– . The leads to AIN+ (Pin 3) and AIN– (Pin 4) should be kept as short as possible. In applications where this is not possible, the AIN+ and AIN– traces should be run side-by- side to cancel noise coupling. SUPPLY BYPASSING High quality, low series resistance 10 µF ceramic bypass capacitors should be used at the VDD and VREF pins. Surface mount ceramic capacitors such as Murata GRM235Y5V106Z016 provide excellent bypassing in a small board space. Alternatively, 10 µF tantalum capaci- tors in parallel with 0.1 µF ceramic capacitors can be used. Bypass capacitors must be located as close to the pins as possible. The traces connecting the pins and the bypass capacitors must be kept short and should be made as wide as possible. POWER-DOWN MODES Upon power-up, the LTC1402 is initialized to the active state and is ready for conversion. The Nap and Sleep Mode waveforms show the power-down modes for the LTC1402. APPLICATIONS INFORMATION DOUT is binary with 1LSB = FS/4096 = 4.096V/4096 = 1.0mV. In applications where absolute accuracy is impor- tant, offset and full-scale errors can be adjusted to zero. Offset error must be adjusted before full-scale error. In Figure 9b, zero offset is achieved by adjusting the offset applied to the AIN– input. For zero offset error apply – 0.5mV (i.e., – 0.5LSB) to AIN+ and adjust the offset at the AIN– input using R8 until the output code flickers between 0000 0000 0000 and 0000 0000 0001. For full-scale ad- justment in Figures 9a and 9b, apply an input voltage of 2.0465V (FS – 1.5LSBs) to AIN+ and adjust R5 until the output code flickers between 1111 1111 1110 and 1111 1111 1111. BOARD LAYOUT AND BYPASSING Wire wrap boards are not recommended for high resolu- tion and/or high speed A/D converters. To obtain the best performance from the LTC1402, a printed circuit board with ground plane is required. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track. An analog ground plane separate from the logic system ground should be established under and around the ADC. Pin 2 (AGND1), Pin 6 (AGND2), Pin 13 (DGND) and all other analog grounds should be connected directly to an analog ground plane. Pin 9 (OGND) should be connected near Pin13 (DGND), where the analog ground plane ties to the logic system ground. The VREF bypass capacitor and the DVDD bypass capacitor should also be connected to this analog ground plane, see Figure 10. No other digital grounds should be connected to this analog ground plane. Figure 10. Power Supply Grounding Practice 1402 F10 AIN + AGND2 AGND1 VREF AVDD DVDD OVDD DOUT OGND LTC1402 DIGITAL SYSTEM SYSTEM GROUND 10 µF 10 µF ANALOG INPUT CIRCUITRY 614 5 4 112 13 9 10 12 3V TO 5V DGND 3 AIN – VSS 2 ANALOG GROUND PLANE 10 µF + – |
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