LP2952-N, LP2952A, LP2953, LP2953A

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SNVS095F – MAY 2004 – REVISED MARCH 2015

Power Dissipation: Heatsink Requirements (Industrial Temperature Range Devices) (continued)

The heatsink is made using the PC board copper. The heat is conducted from the die, through the lead frame

(inside the part), and out the pins which are soldered to the PC board. The pins used for heat conduction are

given in Table 2.

Table 2. Heat Conducting Pins

PART

PACKAGE

PINS

LP2953IN, LP2953AIN

16-pin PDIP

4, 5, 12, 13

LP2953IN-3.3, LP2953AIN-3.3

LP2952IM, LP2952AIM

LP2952IM-3.3, LP2952AIM-3.3

16-pin surface mount (SOIC)

1, 8, 9, 16

LP2953IM, LP2953AIM

LP2953IM-3.3, LP2953AIM-3.3

Figure 49 shows copper patterns which may be used to dissipate heat from the LP2952 and LP2953.

* For best results, use L = 2H.

** 14-Pin PDIP is similar, see Table 2 for pins designated for heatsinking.

Figure 49. Copper Heatsink Patterns

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Product Folder Links: LP2952-N LP2952A LP2953 LP2953A