MX043G datasheet(4/4 Pages) MICROSEMI

4 / 4 page

100% SCREENING

Internal Visual (Precap) Inspection i.a.w. method 2069 and 2072 of MIL-STD-750

Temperature Cycling i.a.w. method 1051 of MIL-STD-750, 10 cycles, -55

°C to +125°C

Thermal Response i.a.w. method 3161 of MIL-STD-750

High Temperature Gate Bias i.a.w. method 1042 cond.B of MIL-STD-750: 24 hrs at Tambient= 125°C, Drain shorted to Source and

VGS= 16 V

High Temperature Reverse Bias i.a.w. method 1042 cond.A of MIL-STD-750: 24 hrs at Tambient= 125°C, Gate shorted to Source and

VDS= 160 V

Final electrical Testing i.a.w. this data sheet (100% DC parameters @ 25

°C and sample (22/0) testing for dynamic parameters and

DC parameters @ temperature extremes)

QUALIFICATION INSPECTION

Thermal Resistance i.a.w. method 3161 of MIL-STD-750 - sample size= 10 devices/0 rejects

Solderability i.a.w. method 2026 of MIL-STD-750 - sample size= 10 devices/0 rejects

Temperature Cycling i.a.w. method 1051 of MIL-STD-750, 200 cycles, -55

°C to +125°C - sample size 10 devices/0 rejects

Intermittent Operation Life i.a.w. method 1042D of MIL-STD-750 with

∆Tj= 75°C for 2000 cycles (monitoring thermal response

shift) - sample= 25 devices/0 rejects

Steady State Operation Life i.a.w. method 1042A of MIL-STD-750 at Tj= 115

°C min. for 1000 hrs - sample= 25 devices/0 rejects

Steady state Gate Life i.a.w. method 1042B of MIL-STD-750 at Tj= 115

°C min. for 1000 hrs. - sample= 25 devices/0 rejects

Safe Operating Area i.a.w. method 3474 of MIL-STD-750 (monitoring thermal response shift) - sample size= 10 devices/0 rejects

Shock i.a.w. method 2016 of MIL-STD-750 - sample size= 10 devices/0 rejects

Vibration i.a.w. method 2056 of MIL-STD-750 - sample size= 10 devices/0 rejects

Acceleration i.a.w. method 2006 of MIL-STD-750 - sample size= 10 devices/0 rejects

X-ray, one view of the die attach area (Oz axis) - sample= 10 devices/0 rejects

Humidity ????? - sample size= 5 devices/0 rejects

MX043G 数据表(PDF) 4 Page - Microsemi Corporation