Data Sheet

ADP2389/ADP2390

Rev. 0 | Page 23 of 23

OUTLINE DIMENSIONS

Figure 38. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

5 mm × 5 mm Body, Very Thin Quad

(CP-32-19)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Output Voltage

Package Description

Package Option

ADP2389ACPZ-R7

−40°C to +125°C

Adjustable

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-19

ADP2390ACPZ-R7

−40°C to +125°C

Adjustable

32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-32-19

ADP2389-EVALZ

Evaluation Board

ADP2390-EVALZ

Evaluation Board

1.777

1.677

1.527

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.152 REF

0.425

0.625

0.984

COPLANARITY

0.08

0.30

0.25

0.20

5.10

5.00 SQ

4.90

1.00

0.90

0.80

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.45

0.35

0.25

COMPLIANT

TO JEDEC STANDARDS MO-220-VHHD

3.80

3.70

3.55

3.441

3.341

3.191

1.725

1.625

1.475

EXPOSED

PAD

EXPOSED

PAD

0.65

0.65

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registered trademarks are the property of their respective owners.

D12192-0-8/15(0)