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USB4604 数据表(PDF) 20 Page - Microchip Technology

部件名 USB4604
功能描述  USB 2.0 HSIC Hi-Speed 4-Port Hub Controller
PDF  62 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

USB4604 数据表(HTML) 20 Page - Microchip Technology

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USB 2.0 HSIC Hi-Speed 4-Port Hub Controller
Datasheet
DS00001716A-page 20
 2014 Microchip Technology Inc.
Note 3.2
When the device is configured to enable the HSIC upstream port, the USB Product ID
(PID) will be 4604. When the device is configured to enable the USB upstream port, the
USB PID will be 4504.
Note 3.3
Configuration strap values are latched on Power-On Reset (POR) and the rising edge of
RESET_N (external chip reset). Configuration straps are identified by an underlined
symbol name. Signals that function as configuration straps must be augmented with an
external resistor when connected to a load. Refer to Section 6.3, "Device Configuration
Straps," on page 32 for additional information.
1
+1.8-3.3V
Core Power
Supply Input
VDDCOREREG
P
+1.8-3.3V core power supply input to internal
+1.2V regulator. This pin may be connected to
VDD33 for single supply applications when VBAT
equals +3.3V. Running in a dual supply
configuration with VDDCOREREG at a lower
voltage, such as +1.8V, may reduce overall
system power consumption. In dual supply
configurations, a 4.7
μF (<1
Ω ESR) capacitor to
ground is required for regulator stability. The
capacitor should be placed as close as possible
to the device. Refer to Chapter 4, "Power
Connections," on page 23 for power connection
information.
1
+1.2V Core
Power Supply
VDDCR12
P
+1.2V core power supply. In single supply
applications or dual supply applications where
1.2V is not used, a 1.0
μF (<1
Ω ESR) capacitor
to ground is required for regulator stability. The
capacitor should be placed as close as possible
to the device. Refer to Chapter 4, "Power
Connections," on page 23 for power connection
information.
1
+1.2V HSIC
Power Supply
Input
VDD12
P
+1.2V HSIC power supply input. Refer to
Chapter 4, "Power Connections," on page 23 for
power connection information.
Exposed
Pad on
package
bottom
(Figure 3.1)
Ground
VSS
P
Common ground. This exposed pad must be
connected to the ground plane with a via array.
Table 3.1 Pin Descriptions (continued)
NUM PINS
NAME
SYMBOL
BUFFER
TYPE
DESCRIPTION



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