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UPD1002 数据表(PDF) 7 Page - Microchip Technology |
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UPD1002 数据表(HTML) 7 Page - Microchip Technology |
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7 / 46 page ![]() 2014 Microchip Technology Inc. DS00001760B-page 7 UPD1002 2.0 PIN DESCRIPTIONS AND CONFIGURATION The pinouts for the package, along with system-level application diagrams, are detailed in the following section: • 32-Pin SQFN (32-SQFN) Note: For a summary of the available pin combinations and their corresponding target applications, refer to Table 1-1. Pin descriptions are detailed in Section 2.2, "Pin Descriptions," on page 14. For details on the CFG_SEL0 and CFG_- SEL1 Configuration Select signals, refer to Section 3.3, "Configuration Selection (CFG_SEL0/CFG_SEL1)," on page 24. 2.1 32-Pin SQFN (32-SQFN) 2.1.1 32-SQFN PIN DIAGRAM Note: When an “_N” is used at the end of the signal name, it indicates that the signal is active low. For example, RESET_N indicates that the reset signal is active low. FIGURE 2-1: 32-SQFN PIN ASSIGNMENTS (TOP VIEW) (Connect exposed pad to ground with a via field) VSS UPD1002 32-SQFN (Top Vi ew) Note: Exposed pad (VSS) on bottom of package must be connected to ground with a via field. *The functionality of this pin is dependent on the CFG_SEL0/CFG_SEL1 profile selection. 1 2 3 4 5 6 7 8 24 23 22 21 20 19 18 17 CFG_SEL1 CFG_SEL0 PD_EN/PD_GOOD* VDD33_CAP VBUS VSW_CAP VTR VDD18A_CAP PD_DATA PD_ID PD_VDD18 VDDIO IMON VMON VDD18_CAP HUB_PWR_EN/VSEL2_N* |
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