| 数据搜索系统,热门电子元器件搜索 |
|
M24M02-DRMN6TP 数据表(PDF) 37 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
M24M02-DRMN6TP 数据表(HTML) 37 Page - STMicroelectronics |
|
37 / 38 page ![]() DocID18204 Rev 8 37/38 M24M02-DR Revision history 37 23-May-2014 7 removed note on page 7, Updated Table 3: Device select code, updated section numbering for Section 5.2.4 and Section 5.2.5, updated note 1 on Table 11: Memory cell data retention, updated Figure 18: WLCSP- 8-bump, 3.556 x 2.011 mm, wafer level chip scale package recommended footprint. 27-Jul-2015 8 Updated: – Figure 3 with note 1. – Table 2 – Section 9.1: SO8N package information and Section 9.2: WLCSP package information Table 18. Document revision history (continued) Date Revision Changes |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |