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STB9NK80Z 数据表(PDF) 3 Page - STMicroelectronics |
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STB9NK80Z 数据表(HTML) 3 Page - STMicroelectronics |
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3 / 15 page ![]() DocID024491 Rev 2 3/15 STB9NK80Z Electrical ratings 1 Electrical ratings Table 2. Absolute maximum ratings Symbol Parameter Value Unit V DS Drain-source voltage 800 V V GS Gate- source voltage ± 30 V I D Drain current (continuous) at T C = 25 °C 5.2 A I D Drain current (continuous) at T C = 100 °C 3.3 A I DM (1) 1. Pulse width limited by junction temperature. Drain current (pulsed) 20.8 A P TOT Total dissipation at T C = 25°C 125 W Derating factor 1 W/°C ESD Gate-source human body model (C = 100 pF, R = 1.5 k Ω)4 kV dv/dt (2) 2. I SD ≤ 5.2 A, di/dt ≤ 200 A/μs, V DD ≤ V (BR)DSS Peak diode recovery voltage slope 4.5 V/ns T j T stg Max operating junction temperature Storage temperature -55 to 150 °C Table 3. Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case max 1 °C/W R thj-amb Thermal resistance junction-ambient max 62.5 °C/W Table 4. Avalanche characteristics Symbol Parameter Value Unit I AR Avalanche current, repetitive or not-repetitive (pulse width limited by Tj Max) 5.2 A E AS Single pulse avalanche energy (starting T J = 25 °C, I D = I AR , V DD = 50 V) 210 mJ |
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