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TOOLS SUPPORTED BY AEROFLEX

Aeroflex supports libraries for:

• Mentor Graphics

− ModelSim

− Tessent FastScan

- Tessent Memory

• Synopsys

- Design Compiler (with PowerCompiler)

- PrimeTime

- PrimePower

- VCS for Verilog and VHDL

- Formality

- TetraMax

• VITAL-compliant VHDL Simulation Tools

• OVI-compliant Verilog Simulation Tools

TRAINING AND SUPPORT

Aeroflex personnel conduct training classes tailored to meet individual needs. These classes can address a wide mix of engineering

backgrounds and specific customer concerns. Applications assistance is also available through all phases of ASIC Design.

PHYSICAL DESIGN

By using five layers of metal interconnect Aeroflex achieves optimized layouts that maximize speed of critical nets, overall chip

performance and design density up to 15,000,000 equivalent gates.

TEST CAPABILITY

Aeroflex supports all phases of test development from test stimulus generation through high-speed production test. This support

includes ATPG, fault simulation and fault grading. Scan design options are available on all UT130nHBD storage elements. Auto-

matic test program development capabilities handle large vector sets for use with Aeroflex's Teradyne Tiger ATEs, supporting

high-speed testing (up to 1.2GHz).

QUALITY AND RELIABILITY

Aeroflex is dedicated to meeting the stringent performance requirements of aerospace and defense systems suppliers. Aeroflex

maintains the highest level of quality and reliability through our Quality Management Program under MIL-PRF-38535 and ISO-

9001. In 1988 we were the first gate array manufacturer to achieve QPL certification and qualification of our technology families.

Our product assurance program has kept pace with the demands of certification and qualification.

Our quality management plan includes the following activities and initiatives.

• Quality improvement plan

• Failure analysis program

• SPC plan

• Corrective action plan

• Change control program

• Standard Evaluation Circuit (SEC) and Technology Characterization Vehicle (TCV) assessment program

• Certification and qualification program

Because of numerous product variations permitted with customer specific designs much of the reliability testing is performed using

a Standard Evaluation Circuit (SEC) and Technology Characterization Vehicle (TCV). Aeroflex utilizes the wafer foundry's data

from TCV test structures to evaluate hot carrier aging, electromigration and time dependent test samples for reliability testing.