ADAV4601BSTZ datasheet(9/60 Pages) AD

9 / 60 page

ADAV4601

Rev. B | Page 9 of 60

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

DVDD to DGND

0 V to 2.2 V

ODVDD to DGND

0 V to 4 V

AVDD to AGND

0 V to 4 V

AGND to DGND

−0.3 V to +0.3 V

Digital Inputs

DGND − 0.3 V to ODVDD + 0.3 V

Analog Inputs

AGND − 0.3 V to AVDD + 0.3 V

Reference Voltage

Indefinite short circuit to ground

Soldering (10 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Thermal resistance is based on JEDEC 2S2P PCB.

Table 4.

Package Type

θJA

θJC

Unit

80-Lead LQFP

38.1

7.6

°C/W

THERMAL CONDITIONS

To ensure correct operation of the device, the case temperature

(TCASE) must be kept below 121°C to keep the junction temperature

(TJ) below the maximum allowed, 125°C.

ESD CAUTION

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