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STV0674 数据表(PDF) 22 Page - STMicroelectronics

部件名 STV0674
功能描述  Tri-mode CMOS digital camera co-processor
PDF  35 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STV0674 数据表(HTML) 22 Page - STMicroelectronics

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Detailed Specifications
STV0674
22/35
4.7
SFP AC parameters
Each SFP is a TTL schmitt trigger bidirectional pad Buffer, 3v3 capable with 2mA drive capability
and Slew-rate Control. The 3.3V IOs comply to the EIA/JEDEC standard JESD8-B. For sake of
convenience the most important parameters for measurement have been extracted and presented
below.
4.8
Sensor interface
Note: 1 The above timings assume that the sensor_clk load is 20pF.
2 The sensor data setup and hold times are requirements of the STV0674.
3 tAC represents the maximum allowed clock to data delay from STV0674 sensor_clk pad to the
STV0674 sensor data pads. (i.e. STV0674 pad to sensor PCB delay + sensor clock to data delay +
sensor data pad to STV0674 pad PCB delay).
Table 7: SFP AC parameters
Symbol
Description
Min.
Typ.
Max.
Unit
Slew_rise
0.3Vcc to 0.6Vcc, CL = 10pF,
balanced RL = 1KR to Vdd
with RL = 1KR to Vss
1.63
1.83
1.97
V/ns
Slew_fall
0.3Vcc to 0.6Vcc, CL = 10pF,
balanced RL = 1KR to Vdd
with RL = 1KR to Vss
2.05
2.32
2.62
V/ns
Figure 12: Sensor interface timing
Table 8: Sensor interface timing
Symbol
Min.
Typ.
Max.
Unit
tCK
0.1875
24
MHz
tCH
40.02
tCK
tCL
40.02
tCK
tDS
7.71
ns
tDH
0ns
tAC
32.39
ns
sensor_clk
sensor_db[4:0]
tCK
tCL
tCH
tDS
tDH
tAC



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