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STV0674 数据表(PDF) 22 Page - STMicroelectronics |
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STV0674 数据表(HTML) 22 Page - STMicroelectronics |
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22 / 35 page ![]() Detailed Specifications STV0674 22/35 4.7 SFP AC parameters Each SFP is a TTL schmitt trigger bidirectional pad Buffer, 3v3 capable with 2mA drive capability and Slew-rate Control. The 3.3V IOs comply to the EIA/JEDEC standard JESD8-B. For sake of convenience the most important parameters for measurement have been extracted and presented below. 4.8 Sensor interface Note: 1 The above timings assume that the sensor_clk load is 20pF. 2 The sensor data setup and hold times are requirements of the STV0674. 3 tAC represents the maximum allowed clock to data delay from STV0674 sensor_clk pad to the STV0674 sensor data pads. (i.e. STV0674 pad to sensor PCB delay + sensor clock to data delay + sensor data pad to STV0674 pad PCB delay). Table 7: SFP AC parameters Symbol Description Min. Typ. Max. Unit Slew_rise 0.3Vcc to 0.6Vcc, CL = 10pF, balanced RL = 1KR to Vdd with RL = 1KR to Vss 1.63 1.83 1.97 V/ns Slew_fall 0.3Vcc to 0.6Vcc, CL = 10pF, balanced RL = 1KR to Vdd with RL = 1KR to Vss 2.05 2.32 2.62 V/ns Figure 12: Sensor interface timing Table 8: Sensor interface timing Symbol Min. Typ. Max. Unit tCK 0.1875 24 MHz tCH 40.02 tCK tCL 40.02 tCK tDS 7.71 ns tDH 0ns tAC 32.39 ns sensor_clk sensor_db[4:0] tCK tCL tCH tDS tDH tAC |
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