bq78350-R1

www.ti.com

SLUSCD0 – AUGUST 2015

8 Specifications

8.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage range

–0.3

2.75

V

Open-drain I/O pins

–0.3

6

V

Input voltage range to all other pins

–0.3

VCC + 0.3

V

–40

85

°C

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

VALUE

UNIT

±2000

V

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

2.4

2.5

2.6

V

SAFE

SMBC, SMBD, VEN

5.5

V

Output voltage range

ADREN, GPIO A, GPIO B, SDATA, SCLK,

PWRM, LED1...5 (when used as GPO)

BAT, VAUX, SMBA

1

SMBD, SMBC, ALERT, DISP, PRES, KEYIN

5.5

Input voltage range

V

SDATA, GPIO A, GPIO B, LED1...5 (when

used as GPI)

Operating Temperature

–40

85

°C

8.4 Thermal Information

bq78350-R1

TSSOP (DBT)

UNIT

30 PINS

Junction-to-ambient thermal resistance

81.4

Junction-to-case(top) thermal resistance

16.2

Junction-to-board thermal resistance

34.1

°C/W

Junction-to-top characterization parameter

0.4

Junction-to-board characterization parameter

33.6

Junction-to-case(bottom) thermal resistance

n/a

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Copyright © 2015, Texas Instruments Incorporated

Submit Documentation Feedback

5

Product Folder Links: bq78350-R1