数据搜索系统，热门电子元器件搜索
  Chinese  ▼
ALLDATASHEETCN.COM

X  

预览 PDF HTML

PIFE32251B-R68MS 数据表(PDF) 148 Page - Texas Instruments

部件名 PIFE32251B-R68MS
功能描述  Simple and Flexible Wide Input Voltage PMU for Mobile Computers
PDF  157 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
制造商  TI1 [Texas Instruments]
网页  http://www.ti.com
标志 TI1 - Texas Instruments

PIFE32251B-R68MS 数据表(HTML) 148 Page - Texas Instruments

Back Button PIFE32251B-R68MS Datasheet HTML 144Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 145Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 146Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 147Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 148Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 149Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 150Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 151Page - Texas Instruments PIFE32251B-R68MS Datasheet HTML 152Page - Texas Instruments Next Button
Zoom Inzoom in Zoom Outzoom out
 148 / 157 page
background image
148
TPS650830
SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016
www.ti.com
Submit Documentation Feedback
Product Folder Links: TPS650830
Layout
Copyright © 2014–2016, Texas Instruments Incorporated
9.2.3
ZCG Package
Figure 9-6. Top Layer ZCG Layout
Figure 9-7. Bottom Layer ZCG Layout
9.3
Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically
requires special attention to power dissipation. Many system-dependent issues such as thermal coupling,
airflow, added heat sinks and convection surfaces, and the presence of other heat-generating components
affect the power-dissipation limits of a given component.
Three basic approaches for enhancing thermal performance are listed below.
•
Improving the power dissipation capability of the PCB design
•
Improving the thermal coupling of the component to the PCB by soldering the PowerPAD™
•
Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the
Thermal Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application
Note (SPRA953).



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100  ...More


数据表 下载

Go To PDF Page


链接网址



ALLDATASHEET是否为您带来帮助?  [ DONATE ] 

关于 Alldatasheet   |   广告服务   |   联系我们   |   隐私政策   |   数据表链接    |   链接交换   |   制造商名单
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com