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PIFE32251B-R68MS 数据表(PDF) 145 Page - Texas Instruments |
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PIFE32251B-R68MS 数据表(HTML) 145 Page - Texas Instruments |
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145 / 157 page  10 mil Inner Balls = Ball Pad = Via, with 20 mil pad and 10 mil drill = Top Layer Trace = Inner 1 / Bottom Layer Trace = Inner 2 / Bottom Layer Trace 20 mil 4 mil 145 TPS650830 www.ti.com SLVSCF4A – DECEMBER 2014 – REVISED JULY 2016 Submit Documentation Feedback Product Folder Links: TPS650830 Layout Copyright © 2014–2016, Texas Instruments Incorporated 9.1.2 Fanout for ZCG using Type 3 Routing The ZCG has some of the inner balls removed to essentially create a 0.1-mm ball pitch for the inner balls of the package. This feature allows for Type 3 routing of the board. This Type 3 routing has no vias in pad, no blind and buried vias, and minimum trace width / spacing of 4 mils. Figure 9-2. Fanout for ZCG Package using Type 3 Routing |
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