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STM32F091CB 数据表(PDF) 107 Page - STMicroelectronics |
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STM32F091CB 数据表(HTML) 107 Page - STMicroelectronics |
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107 / 127 page  DocID026284 Rev 3 107/127 STM32F091xB STM32F091xC Package information 124 Figure 40. Recommended footprint for UFBGA64 package Device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. ddd - - 0.080 - - 0.0031 eee - - 0.150 - - 0.0059 fff - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 74. UFBGA64 recommended PCB design rules Dimension Recommended values Pitch 0.5 Dpad 0.280 mm Dsm 0.370 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.280 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.100 mm Table 73. UFBGA64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.460 0.530 0.600 0.0181 0.0209 0.0236 |
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