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STM32F091CB 数据表(PDF) 110 Page - STMicroelectronics |
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STM32F091CB 数据表(HTML) 110 Page - STMicroelectronics |
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110 / 127 page  Package information STM32F091xB STM32F091xC 110/127 DocID026284 Rev 3 Figure 43. Recommended footprint for WLCSP64 package b(2) 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 3.312 3.347 3.382 0.1304 0.1318 0.1331 E 3.550 3.585 3.620 0.1398 0.1411 0.1425 e - 0.400 - - 0.0157 - e1 - 2.800 - - 0.1102 - e2 - 2.800 - - 0.1102 - F - 0.2735 - - 0.0108 - G - 0.3925 - - 0.0155 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. Table 76. WLCSP64 recommended PCB design rules Dimension Recommended values Pitch 0.4 Dpad 260 µm max. (circular) 220 µm recommended Dsm 300 µm min. (for 260 µm diameter pad) PCB pad design Non-solder mask defined via underbump allowed. Table 75. WLCSP64 package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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