| 数据搜索系统,热门电子元器件搜索 |
|
STM32F413MH 数据表(PDF) 175 Page - STMicroelectronics |
|
|
|||||||||||||||||||||||||||||
STM32F413MH 数据表(HTML) 175 Page - STMicroelectronics |
|
175 / 207 page ![]() DocID029162 Rev 2 175/207 STM32F413xG/H Package information 205 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 WLCSP81 package information Figure 63. WLCSP81 - 81-ball, 4.039 x 3.951 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. |
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |