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STM32F413MH 数据表(PDF) 176 Page - STMicroelectronics |
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STM32F413MH 数据表(HTML) 176 Page - STMicroelectronics |
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176 / 207 page ![]() Package information STM32F413xG/H 176/207 DocID029162 Rev 2 Table 102. WLCSP81 - 81-ball, 4.039 x 3.951 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) 1. Values in inches are converted from mm and rounded to 4 decimal digits. Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A3(2) 2. Back side coating - 0.025 - - 0.0010 - Ø b(3) 3. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 0.220 0.250 0.280 0.0087 0.0098 0.0110 D 4.004 4.039 4.074 0.1576 0.1590 0.1604 E 3.916 3.951 3.986 0.1542 0.1556 0.1569 e - 0.400 - - 0.0157 - e1 - 3.200 - - 0.1260 - e2 - 3.200 - - 0.1260 - F - 0.4195 - - 0.0165 - G - 0.3755 - - 0.0148 - aaa - - 0.100 - - 0.0039 bbb - - 0.100 - - 0.0039 ccc - - 0.100 - - 0.0039 ddd - - 0.050 - - 0.0020 eee - - 0.050 - - 0.0020 |
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