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STM32F413MH 数据表(PDF) 177 Page - STMicroelectronics |
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STM32F413MH 数据表(HTML) 177 Page - STMicroelectronics |
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177 / 207 page ![]() DocID029162 Rev 2 177/207 STM32F413xG/H Package information 205 Figure 64. WLCSP81- 81-ball, 4.039 x 3.951 mm, 0.4 mm pitch wafer level chip scale package recommended footprint Table 103. WLCSP81 recommended PCB design rules (0.4 mm pitch) Dimension Recommended values Pitch 0.4 mm Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm |
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