STW4510 datasheet(52/57 Pages) STMICROELECTRONICS

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STw4510

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Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®

packages. These packages have a Lead-free second level interconnect. The category of

second Level Interconnect is marked on the package and on the inner box label, in

compliance with JEDEC Standard JESD97.

The maximum ratings related to soldering conditions are also marked on the inner box label.

ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.

7.1

TFBGA 84 balls 6 mm x 6 mm x 1.2 mm

See

Figure 10: TFBGA84 6 mm x 6 mm x 1.2 mm outline drawing.

Table 32.

TFBGA84 6 mm x 6 mm x 1.2 mm - 0.5mm ball pitch (1) (2)

These measurements conform to JEDEC standards

Drawing dimensions

Parameter

Min.

Typ.

Max.

Unit

1.16

0.20

0.25

0.30

0.82

0.25

0.30

0.35

5.90

6.00

6.10

4.50

5.90

6.00

6.10

4.50

0.45

0.50

0.55

0.65

0.75

0.85

ddd

0.08

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