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P9025AC-RNBGI 数据表(PDF) 2 Page - Integrated Device Technology

部件名 P9025AC-RNBGI
功能描述  5W, Qi Wireless Power Receiver
PDF  20 Pages
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制造商  IDT [Integrated Device Technology]
网页  http://www.idt.com
标志 IDT - Integrated Device Technology

P9025AC-RNBGI 数据表(HTML) 2 Page - Integrated Device Technology

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5W, QI WIRELESS POWER RECEIVER WITH INTEGRATED RECTIFIER AND LDO OUTPUT
2
09/01/15
P9025AC DATASHEET
Absolute Maximum Ratings
Stresses above the ratings listed below (Table 1 and Table 2) can cause permanent damage to the P9025AC. These ratings,
which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these
or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the
recommended operating temperature range.
Table 1: Absolute Maximum Ratings Summary
Table 2: Package Thermal Information1,2,3,4
NOTES:
1. The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / ΘJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will result in excessive die
temperature, and the device will enter thermal shutdown.
2. This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3" x 4.5" in still air conditions.
3. Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
4. For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH) vias, from top to bottom sides of
the PCB, is recommended for improving the overall thermal performance.
Table 3: ESD Information
Pins
Rating
Units
AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2 to PGND_
-0.3 to 20
V
BST1, BST2 to PGND1
-0.3 to (AC1, AC2 + 6)
V
INT, EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CHG_END/CS100, FOD1, FOD2, VDD to AGND
-0.3 to 6
V
PGND, PGND1, PGND2, to AGND
-0.3 to 0.3
V
Out Current
1.5
A
AC1, AC2 Current
2ARMS
Symbol
Description
Rating (VFQFPN)
Units
ΘJA
Thermal Resistance Junction to Ambient
35
C/W
ΘJC
Thermal Resistance Junction to Case
29.6
C/W
ΘJB
Thermal Resistance Junction to Board
2.4
C/W
TJ
Operating Junction Temperature
0 to +125
C
TA
Ambient Operating Temperature
0 to +85
C
TSTG
Storage Temperature
-55 to +150
C
TLEAD
Lead Temperature (soldering, 10s)
300
C
Test Model
Pins
Ratings
Units
HBM
All pins
±1500
V
CDM
All pins
±500
V



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