P9242-R Datasheet

© 2016 Integrated Device Technology, Inc

2

December 16, 2016

Contents

1.

Pin Assignments...........................................................................................................................................................................................5

2.

Pin Descriptions............................................................................................................................................................................................6

3.

Absolute Maximum Ratings..........................................................................................................................................................................8

4.

Electrical Characteristics ..............................................................................................................................................................................9

5.

Typical Performance Characteristics..........................................................................................................................................................11

6.

Function Block Diagram .............................................................................................................................................................................13

7.

Theory of Operation....................................................................................................................................................................................14

7.1 Over-Current Limit – ILIM ..................................................................................................................................................................14

7.2 Enable Pin – EN ................................................................................................................................................................................14

7.3 Buzzer – BUZR..................................................................................................................................................................................14

7.4 Voltage Demodulation – VDEM1.......................................................................................................................................................14

7.5 Current Demodulation – IDEMI .........................................................................................................................................................15

7.6 Thermal Protection ............................................................................................................................................................................15

7.7 External Temperature Sensing – TS .................................................................................................................................................15

7.8 LEDs Pattern Selection – LED_PAT .................................................................................................................................................15

7.9 Foreign Object Detection...................................................................................................................................................................16

7.10 Step-Down Regulator ........................................................................................................................................................................17

7.11 Linear Regulators – PREG, LDO33, and LDO18 ..............................................................................................................................17

7.12 Under-Voltage Lock-Out (UVLO) Protection......................................................................................................................................17

7.13 LC Resonant Circuit ..........................................................................................................................................................................17

8.

Communication Interface............................................................................................................................................................................18

8.1 Modulation/Communication ...............................................................................................................................................................18

8.2 Bit Decoding Scheme for ASK...........................................................................................................................................................19

8.3 Byte Decoding for ASK......................................................................................................................................................................19

8.4 Packet Structure ................................................................................................................................................................................19

9.

WPC Mode Characteristics ........................................................................................................................................................................20

9.1 Selection Phase.................................................................................................................................................................................20

9.2 Ping Phase (Digital Ping)...................................................................................................................................................................20

9.3 Identification and Configuration Phase..............................................................................................................................................21

9.4 Negotiation Phase .............................................................................................................................................................................21

9.5 Calibration Phase ..............................................................................................................................................................................21

9.6 Power Transfer Phase.......................................................................................................................................................................21

10. Functional Registers...................................................................................................................................................................................22

11. Application Information ...............................................................................................................................................................................24

11.1 Power Dissipation and Thermal Requirements .................................................................................................................................24

11.2 Typical Application Schematic...........................................................................................................................................................25

11.3 Bill of Materials (BOM).......................................................................................................................................................................26

12. Package Outline Drawing ...........................................................................................................................................................................28