P9242-R Datasheet

© 2016 Integrated Device Technology, Inc

8

December 16, 2016

3. Absolute Maximum Ratings

The absolute maximum ratings are stress ratings only. Stresses beyond those listed under “Absolute Maximum Ratings” might cause

permanent damage to the P9242-R. Functional operation of the P9242-R at absolute maximum ratings is not implied. Exposure to absolute

maximum rating conditions for extended periods could affect long-term reliability.

Table 2.

Absolute Maximum Ratings

Pins[a]

Rating[b]

Units

EN

̅̅̅̅, VIN, SW_S, VBRG_IN, SW_BRG1, SW_BRG2, CSP, CSN, BST_BRG1, BST_BRG2, GH_BRG1,

GH_BRG2

-0.3 to 28

V

PREG, LDO33, VIN_LDO, LED1, LED2, VDDIO, SCL, SDA, ILIM, LED_PAT, VCOIL, TS, BUZR,

OVP_CTL, GPIO, D-, D+, Q_DRV1, Q_DRV2, GL_BRG1, GL_BRG2, VDEM1, IDEMI, ISNS_OUT,

DRV_VIN

-0.3 to 6

V

LDO18

-0.3 to 2

V

[a] Absolute maximum ratings are not provided for reserved pins (RSV). These pins are not used in the application.

[b] All voltages are referred to ground unless otherwise noted. All GND pins and the exposed pad (EP) connected together.

Table 3.

Package Thermal Information

Symbol

Description

VFQFN Rating

Units

Thermal Resistance Junction to Ambient[a], [b], [c]

27.2

C/W

Thermal Resistance Junction to Case [b], [c]

18.8

C/W

Thermal Resistance Junction to Board[b], [c]

1.36

C/W

Operating Junction Temperature[a], [b]

-40 to +125

C

Ambient Operating Temperature[a], [b]

-40 to +85

C

Storage Temperature

-55 to +150

C

Lead Temperature (soldering, 10s)

+300

C

result in excessive die temperature, and the device will enter thermal shutdown.

[c] Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted

variables.

Table 4.

ESD Information

Test Model

Pins

Ratings

Units

HBM

All pins.

±2000

V

CDM

All pins.

±500

V