ADA4350ARUZ-R7 datasheet(16/38 Pages) AD

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Data Sheet

ADA4350

Rev. B | Page 15 of 37

ABSOLUTE MAXIMUM RATINGS

Table 10.

Parameter

Rating

Analog Supply Voltage

14 V

Digital Supply Voltage

5.5 V

Power Dissipation

See Figure 4

Common-Mode Input Voltage

±Vs ± 0.3V

Differential Input Voltage

±0.7 V

Input Current (IN-N, IN-P, VIN1, RF1, and REF)

20 mA

Storage Temperature Range

−65°C to +125°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature (Soldering, 10 sec)

300°C

Junction Temperature

150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst case conditions, that is, θJA is

specified for a device soldered in a circuit board for surface-

mount packages. Table 11 lists the θJA for the ADA4350.

Table 11. Thermal Resistance

Package Type

θJA

Unit

28-Lead TSSOP

72.4

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the ADA4350 is limited

by the associated rise in junction temperature (TJ) on the die. At

approximately 150°C, which is the glass transition temperature,

the properties of the plastic change. Even temporarily exceeding

this temperature limit may change the stresses that the package

exerts on the die, permanently shifting the parametric performance

of the ADA4350. Exceeding a junction temperature of 175°C for

an extended period can result in changes in silicon devices,

potentially causing degradation or loss of functionality.

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the die

due to the ADA4350 output load drive.

The quiescent power dissipation is the voltage between the supply

pins (±VS) multiplied by the quiescent current (IS).

PD = Quiescent Power + (Total Drive Power − Load Power)

(

)

OUT

−













Consider rms output voltages. If RL is referenced to −VS, as in

single-supply operation, the total drive power is +VS × IOUT. If

the rms signal levels are indeterminate, consider the worst case,

when VOUT = +VS/4 for RL to midsupply for dual supplies and

VOUT = +VS/2 for single supply.

(

) (

)

OUT

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more metal directly in contact with the package leads

and exposed pad from metal traces, through holes, ground, and

power planes reduces θJA.

Figure 4 shows the maximum safe power dissipation in the

package vs. the ambient temperature on a JEDEC standard

4-layer board. θJA values are approximations.

0.5

1.0

1.5

2.0

2.5

3.0

–55 –45 –35 –25 –15 –5

AMBIENT TEMPERAURE (°C)

28-LEAD TSSOP

TJ = 150°C

Figure 4. Maximum Power Dissipation vs. Ambient Temperature for a

4-Layer Board

ESD CAUTION

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