ADA4530-1ARZ-R7 datasheet(39/51 Pages) AD

39 / 51 page

ADA4530-1

Data Sheet

Rev. A | Page 38 of 50

400

–400

–300

–200

–100

100

200

300

–100

100

–20

–40

–60

–80

APPLIED VOLTAGE (mV)

Figure 114. Current to Voltage Response of RMA Contaminated Insulation

ADA4530-1

RBATT

VBATT

VOUT

IBATT

BATTERY

MODEL

Figure 115. TIA Circuit with Contamination Battery

CLEANING AND HANDLING

The contamination described in the Contamination section can

usually be removed by an appropriate cleaning process. Solvents

like isopropyl alcohol (IPA) are effective at removing the residue

from solder fluxes and body oils. Use high purity cleanroom

grade solvents to ensure that there is no additional contamina-

tion from the solvent itself.

Insulators that are severely contaminated benefit from mechani-

cal abrasion in addition to the solvent. Ultrasonic cleaners are

highly effective. Scrubbing the area around the high impedance

insulators with an acid brush also works. Flush the insulators

with a final wash of fresh IPA to remove any contaminants

suspended in the solvent.

The residual moisture must be allowed to completely evaporate

before the insulator can be used. This evaporation may take

many hours at room temperature; the process can be accelerated

by baking the insulators in an oven at elevated temperature.

For detailed cleaning and handling procedures, refer to the

ADA4530-1R-EBZ User Guide.

SOLDER PASTE SELECTION

Solder paste selection can drastically impact the performance of

the board if not cleaned properly. Solder flux residue on a PCB

degrades the low IB performance of the amplifier. An experiment

was performed to evaluate the cleaning procedure for different

solder paste types. Table 7 shows the result of the experiment.

The recommended cleaning procedure column lists the times

required to restore the effective input bias currents to less than

1 fA. The suggested solder paste of choice is the RMA type.

Table 7. Recommended Cleaning Procedures for Different Solder Paste Material

Solder Paste Type

Solder Paste Part Number

Recommended Cleaning Procedure1

RMA

AIM RMA258-15R

15 min clean time in an ultrasonic cleaner with fresh IPA, followed by 1.5 hours

of bake time at 125°C

Water Soluble

SAC305 Shenmao

1.5 hours clean time in an ultrasonic cleaner with fresh IPA, followed by 1.5 hours

of bake time at 125°C

No Clean

SAC 305 AMTECH LF4300

3 hours clean time in an ultrasonic cleaner with fresh IPA, followed by 3 hours of

bake time at 125°C

1 Bake time was not optimized and was set equal to the cleaning time.

ADA4530-1ARZ-R7 数据表(PDF) 39 Page - Analog Devices

ADA4530-1ARZ-R7 数据表(HTML) 39 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

数据表下载