ADA4807-2ACPZ-R2 datasheet(30/33 Pages) AD

30 / 33 page

ADA4807-1/ADA4807-2/ADA4807-4

Data Sheet

Rev. B | Page 30 of 33

LAYOUT, GROUNDING, AND BYPASSING

The ADA4807-1/ADA4807-2/ADA4807-4 are high speed

devices. Realizing their superior performance requires attention

to the details of high speed printed circuit board (PCB) design.

The first requirement is to use a multilayer PCB with solid ground

and power planes that cover as much of the board area as possible.

Bypass each power supply pin directly to a nearby ground plane,

as close to the device as possible. Use 0.1 µF high frequency

ceramic chip capacitors.

Provide low frequency bulk bypassing using 10 µF tantalum

capacitors from each supply to ground.

Stray transmission line capacitance in combination with

package parasitics can potentially form a resonant circuit at

high frequencies, resulting in excessive gain peaking or possible

oscillation. Signal routing must be short and direct to avoid such

parasitic effects. Provide symmetrical layout for complementary

signals to maximize balanced performance.

Use radio frequency transmission lines to connect the driver

and receiver to the amplifier.

Minimize stray capacitance at the input and output pins by

clearing the underlying ground and low impedance planes

near these pins.

If the driver and receiver are more than one-eighth of the

wavelength from the amplifier, minimize the signal trace

widths. This nontransmission line configuration requires

clearing of the underlying and adjacent ground and low

impedance planes near the signal lines.

ADA4807-2ACPZ-R2 数据表(PDF) 30 Page - Analog Devices