ADA4807-2ACPZ-R2 datasheet(9/33 Pages) AD

9 / 33 page

Data Sheet

ADA4807-1/ADA4807-2/ADA4807-4

Rev. B | Page 9 of 33

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

11 V

Internal Power Dissipation

See Figure 5

Input Voltage (Common Mode)

±VS ± 0.2 V

Differential Input Voltage

±1.4 V

Output Short-Circuit Duration

See power

derating curves in

Figure 5

Storage Temperature Range (All Packages)

−65°C to +125°C

Lead Temperature (Soldering 10 sec)

300°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

ADA4807-1/ADA4807-2/ADA4807-4 is limited by the associated

rise in junction temperature. The maximum safe junction

temperature for plastic encapsulated devices is determined by

the glass transition temperature of the plastic, approximately

150°C. Exceeding this limit temporarily can cause a shift in

parametric performance due to a change in the stresses exerted

on the die by the package. Exceeding a junction temperature of

175°C for an extended period can result in device failure.

Although the ADA4807-1/ADA4807-2/ADA4807-4 are

internally short-circuit protected, this may not be sufficient to

guarantee that the maximum junction temperature (150°C) is

not exceeded under all conditions. To ensure proper operation,

it is necessary to observe the power derating curves shown in

Figure 5.

THERMAL RESISTANCE

θJA is specified for the worst case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 6. Thermal Resistance

Package Type

θJA

Unit

6-Lead SC70, 4-Layer Board

209

°C/W

6-Lead SOT-23, 4-Layer Board

223

°C/W

8-Lead MSOP

123

°C/W

10-Lead LFCSP

°C/W

14-Lead TSSOP

130

°C/W

–40

–25

–10

110

125

AMBIENT TEMPERATURE (°C)

SOT-23

TSSOP

MSOP

LFCSP

SC70

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

Figure 5. Maximum Power Dissipation vs. Ambient Temperature for a

4-Layer Board

ESD CAUTION

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