ADP2443

Data Sheet

Rev. 0 | Page 6 of 24

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

PVIN, EN, PGOOD, RAMP

−0.3 V to +40 V

SW

−1 V to +40 V

BST

FB, SS, COMP, RT/SYNC

−0.3 V to +6 V

VREG

−0.3 V to +6 V

PGND to GND

−0.3 V to +0.3 V

Operating Junction Temperature Range

−40°C to +125°C

Storage Temperature Range

−65°C to +150°C

Soldering Conditions

JEDEC J-STD-020

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

Table 3. Thermal Resistance

Package Type

Unit

42.6

6.8

°C/W

1

Thermal impedance simulated value is based on a 4-layer, JEDEC standard board.

ESD CAUTION