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ADP7182ACPZ-R7 数据表(PDF) 27 Page - Analog Devices

部件名 ADP7182ACPZ-R7
功能描述  Positive or negative enable logic
PDF  31 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP7182ACPZ-R7 数据表(HTML) 27 Page - Analog Devices

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Data Sheet
ADP7182
Rev. I | Page 27 of 31
140
120
100
80
60
40
20
0
00.7
0.5
0.6
0.4
0.3
0.2
0.1
TOTAL POWER DISSIPATION (W)
500mm2
300mm2
100mm2
25mm2
JEDEC
TJ MAX
Figure 96. Junction Temperature vs. Total Power Dissipation for the
5-Lead TSOT, TA = 50°C
140
120
100
80
60
40
20
0
00.40
0.35
0.25
0.30
0.20
0.15
0.10
0.05
TOTAL POWER DISSIPATION (W)
500mm2
300mm2
100mm2
25mm2
JEDEC
TJ MAX
Figure 97. Junction Temperature vs. Total Power Dissipation for the
5-Lead TSOT, TA = 85°C
Thermal Characterization Parameter, ΨJB
When the board temperature is known, use the thermal
characterization parameter, ΨJB, to estimate the junction
temperature rise (see Figure 98 and Figure 100). Maximum
junction temperature (TJ) is calculated from the board temperature
(TB) and power dissipation (PD) using the following formula:
TJ = TB + (PD × ΨJB)
(6)
The typical value of ΨJB is 18.2°C/W for the 8-lead LFCSP package,
44.1°C/W for the 6-lead LFCSP package and 43°C/W for the 5-lead
TSOT package.
140
120
100
80
60
40
20
0
07
56
4
3
2
1
TOTAL POWER DISSIPATION (W)
TB = 25°C
TB = 50°C
TB = 85°C
TJ MAX
Figure 98. Junction Temperature vs. Total Power Dissipation for the
8-Lead LFCSP, TA = 85°C
TOTAL POWER DISSIPATION (W)
0
20
40
60
80
100
120
140
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
TB = 25°C
TB = 50°C
TB = 65°C
TB = 85°C
TJ MAX
Figure 99. Junction Temperature vs. Total Power Dissipation for the
6-Lead LFCSP, TA = 85°C
140
120
100
80
60
40
20
0
07
56
4
3
2
1
TOTAL POWER DISSIPATION (W)
TB = 25°C
TB = 50°C
TB = 85°C
TJ MAX
Figure 100. Junction Temperature vs. Total Power Dissipation for the
5-Lead TSOT, TA = 85°C



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