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FT231XS-R 数据表(PDF) 36 Page - Future Technology Devices International Ltd. |
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FT231XS-R 数据表(HTML) 36 Page - Future Technology Devices International Ltd. |
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36 / 44 page ![]() Copyright © 2013 Future Technology Devices International Limited 36 FT231X USB TO FULL HANDSHAKE UART IC Datasheet Version 1.2 Document No.: FT_000565 Clearance No.: FTDI# 261 9 Package Parameters The FT231X is available in two different packages. The FT231XS is the SSOP-20 option and the FT231XQ is the QFN-20 package option. The solder reflow profile for both packages is described in Section 0. 9.1 SSOP-20 Package Mechanical Dimensions Figure 9.1 SSOP-20 Package Dimensions The FT231XS is supplied in a RoHS compliant 20 pin SSOP package. The package is lead (Pb) free and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC. This package is nominally 8.66mm x 3.91mm body (8.66mm x 5.99mm including pins). The pins are on a 0.635 mm pitch. The above mechanical drawing shows the SSOP-20 package. . |
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