Copyright © 2013 Future Technology Devices International Limited

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FT240X USB 8-BIT FIFO IC Datasheet

Version 1.3

Document No.: FT_000626 Clearance No.:

FTDI# 259

9 Package Parameters

The FT240X is available in two different packages. The FT240XS is the SSOP-24 option and the FT240XQ

is the QFN-24 package option. The solder reflow profile for both packages is described in Section 9.5.

9.1 SSOP-24 Package Mechanical Dimensions

Figure 9.1 SSOP-24 Package Dimensions

The FT240XS is supplied in a RoHS compliant 24 pin SSOP package. The package is lead (Pb) free and

uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.

This package is nominally 8.66mm x 3.91 mm body (8.66mm x 5.99mm including pins). The pins are on

a 0.635 mm pitch. The above mechanical drawing shows the SSOP-24 package.

The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.

The code XXXXXXXXXXXX is the manufacturing LOT code.