Copyright © 2013 Future Technology Devices International Limited

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FT240X USB 8-BIT FIFO IC Datasheet

Version 1.3

Document No.: FT_000626 Clearance No.:

FTDI# 259

9.3 QFN-24 Package Mechanical Dimensions

Figure 9.3 QFN-24 Package Dimensions

The FT240XQ is supplied in a RoHS compliant leadless QFN-24 package - WQFN(X424), with pad size

114x114. The package is lead ( Pb ) free, and uses a ‘green’ compound. The package is fully compliant

with European Union directive 2002/95/EC.

This package is nominally 4.0mm x 4.0mm. The solder pads are on a 0.50mm pitch. The above

mechanical drawing shows the QFN-24 package. All dimensions are in millimetres.

The centre pad on the base of the FT240XQ is internally connected to GND, and the PCB should not have

tracking on the top layer in this area.

The date code format is YYXX where XX = 2 digit week number, YY = 2 digit year number.

The code XXXXXXX is the manufacturing LOT code.