STM8T141 datasheet(41/50 Pages) STMICROELECTRONICS

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STM8T141

Package characteristics

Doc ID 15699 Rev 7

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10.2

Package thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 12: Operating characteristics on page 30.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x JA)

Where:

●

TAmax is the maximum ambient temperature in C

●



JA is the package junction-to-ambient thermal resistance in C/W

●

PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)

●

PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.

●

PI/Omax represents the maximum power dissipation on output pins

Where:



PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH), 

taking into account the actual VOL/IOL and VOH/IOH of the I/Os at low and high level in

the application.

10.2.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

Table 25.

Thermal characteristics(1)

Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit



Thermal resistance junction-ambient



SO8 (Narrow)

130

°C/W



Thermal resistance junction-ambient



UFDFPN 8 (2 x 3 mm)

120

°C/W

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