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AMS002-R 数据表(PDF) 26 Page - Silicon Laboratories |
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AMS002-R 数据表(HTML) 26 Page - Silicon Laboratories |
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26 / 29 page ![]() AMS00x • Embedded Bluetooth Low Energy Solution Packaging, Handling & Storage, RoHS, Section 8 ADS-MS00x-107R • Preliminary Data Sheet Page | 22 ©2014-2015 ACKme Networks. http://ack.me September 14, 2015 8.3 Handling & Storage CAUTION MSL3 Sensitive Device! AMS00x modules are moisture sensitive devices rated at Moisture Sensitive Level 3 (MSL3) per IPC/JEDEC J-STD-20. After opening the moisture sealed storage bag, mod- ules that will be subjected to reflow solder or other high temperature processes must be: 1. mounted to a circuit board within 168 hours at factory conditions (≤30°C and <60% RH) OR 2. continuously stored per IPC/JEDEC J-STD-033 Modules that have been exposed to moisture and envi- ronmental conditions exceeding packaging and storage conditions MUST be baked before mounting according to IPC/JEDEC J-STD-033. Failure to meet packaging and storage conditions will result in irreparable damage to modules during solder reflow. 8.4 RoHS Directive Each AMS00x module is produced according to the RoHS (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) di- rective and complies with the directive. |
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